Different methods for cross-section doping topography of SiC Trenched-singly-implanted vertical junction field effect transistors (TSI-VJFETs) are presented with the purpose to determine the doping distribution in the epitaxial structure and the implanted areas.

The Hall hole density pH and Hall mobility µH in highly aluminum-doped 4H-SiC have been investi-gated in the wide temperature range between 100 K and 900 K. After an overview of the literature data related to the analysis of electrical transport experiments, a model taking into account the two upper-most valence bands of heavy and lights holes, one single acceptor energy EA and the empirical Hall factor rHexp has been discussed in details. The limits of the applied model as a function of temperature and acceptor concentration have been considered. For each analyzed sample, the acceptor density NA and the compensation ratio ND/NA have been experimentally assessed by capacitance-voltage and secondary ion mass spectroscopy measurements. Finally, the Hall carrier concentration vs doping level NA-ND as well as ionization energy of acceptor EA vs acceptor concentration NA in 4H-SiC have been discussed.

Electrical Transport Properties of Highly Aluminum Doped p-Type 4H-SiC

The effect of germanium (Ge) on n-type 4H-SiC is experimentally studied by electrical characterization of homoepitaxial layers grown by chemical vapor deposition (CVD). Measurements show that electrical properties of epitaxial layers can be changed by intentional incorporation of germane (GeH4) gas during the deposition process. On the nanoscale, two-dimensional mappings acquired with conductive atomic force microscopy show preferential conductive paths on the surface of Gedoped samples, which are related to the presence of this isoelectronic impurity. Hall effect measurements confirm that also macroscopic electrical properties of n-type 4H-SiC are improved due to incorporation of Ge into SiC during CVD growth. In particular, despite equal free electron concentration, enhanced mobility in a wide temperature range is measured in Ge-doped samples as compared to a pure 4H-SiC layer. Based on our results from Hall effect measurements as well as admittance spectroscopy and deep level transient spectroscopy, it is speculated that Ge influences the generation and annealing of other point defects and thus helps to reduce the total concentration of defects

Electrical transport (resistivity and Hall Effect) have been studied in silicon doped aluminum nitride (AlN) thick epitaxial layers from 250 K up to 1000 K. The investigated samples, grown by molecular beam epitaxy were characterized by n-type conduction with an ambient temperature free carrier concentration of about ~ 1 x 10^15 cm^3. The donor level, situated about 250 meV below the conduction band edge, was found to be responsible for the experimentally observed increase of free carrier concentration withtemperature. The temperature dependence of carrier mobility has been analyzed in the framework of a multimode scattering model. In the investigated samples the main scattering mechanism is supposed to be dislocation scattering.